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Our Services

πŸ’‘ Design

  • Design for integrating CMOS integrated circuits with high value-added functions (sensors, photonics, etc.)
  • Design and analysis of impurity profiles and operating potentials (TCAD, Spectra)

πŸ”¬ Fabrication and Prototyping

  • Integrated Circuit (Up to 4-inch wafers; supports gate lengths of 1.5 ΞΌm and 5 ΞΌm)
    • CMOS Integrated Circuits
    • Mixed CMOS/JFET Integrated Circuits
    • Devices integrating ICs with MEMS, sensors, and functional materials
    • Potential-detection multimodal sensor arrays (light, ion, pressure, etc.)
  • Device
    • GaN and GaN/Si devices (Micro-LEDs, Micro-LED arrays)
    • Optical devices using compound semiconductors (LEDs, solar cells)
    • Optical waveguides (Si, SiGe processing)
    • MEMS, microfluidic channels, and ΞΌTAS devices
  • Packaging (Wafer dicing, bonding)

πŸŽ“ Education Programs

  • Integrated Circuit Technology Course for professionals and students (covering everything from n-MOS IC processing to evaluation: 5-day course)
  • Workshop on Co-Creation and nurturing for Advanced Semiconductor Engineer with a Broad Perspective – CMOS LSI Full Process Course – (A nine-day practical course focused on manufacturing an image sensor using the Planar CMOS process)

πŸ§ͺ Evaluation

  • Wafer Process Evaluation (Thin film thickness measurement, step height measurement, CD measurement, observation)
  • Electrical Characteristic Measurement and Evaluation (MOSFETs, CMOS Integrated Circuits)

Support Menu

Menu Description
β‘  Technical Consultation Staff provide consultation to help solve technical problems.
β‘‘ Equipment Usage Users with operational skills operate the equipment themselves to conduct experiments.
β‘’ Technical Assistance Users operate the equipment under the guidance and assistance of staff.
β‘£ Technical Service Staff perform technical work (operation) on behalf of the user based on their request.
β‘€ Joint Research Users and university researchers conduct research jointly and publish results.

Result Reporting

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